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Product Highlights:
Four output modes: Headphone Amp, Headphone Amp+Line out, DAC, and Pre-amplifier.
QCC5125 chipset, supports LDAC/ AAC/SBC/APTX/APTX LL/APTX HD protocol
2nd generation 8 core XMOS XU208, USB input supports up to PCM 32bit/768kHz and DSD512 native
Optimized NFCA circuit, with ultra low noise and distortion
32ohm load: 1800mW x2 | 300ohm load: 250mW x2
Two gain settings, +6dB Lo Gain | +19dB Hi Gain
Premium ESS Sabre DAC Chip
Topping DX3 Pro+ is equipped with a high-performance ES9038Q2M DAC chip from ESS Sabre Technologies. It achieves an ultra-low THD+N rating of 0.00015%, ensuring top-notch performance.
High-Performance XMOS USB Processor
Topping DX3 Pro+ features a premium XMOS XU208 USB processor that excels in high-resolution PCM and DSD decoding. Enjoy support for 32-Bit/768kHz and native DSD512 decoding.
Powerful NFCA Headphone Amp Circuit
The new NFCA headphone amp circuit in DX3 Pro+ provides potent signal amplification with ultra-low noise and distortion. Compatible with both high-sensitivity low impedance IEMs and power-hungry full-size headphones, it outputs up to 1.8W at 32Ω load with two-level gain modes
Qualcomm's Latest Bluetooth Chip
Adopting Qualcomm's advanced QCC5125 Bluetooth chipset, Topping DX3 Pro+ offers high-res Bluetooth connection with LDAC, APTX HD, APTX LL, AptX, SBC, and AAC codecs. The signal bypasses the internal DAC of QCC5125 for decoding by ES9038Q2M.
Difference Between DX3 Pro and DX3 Pro+
DX3 Pro+ represents an upgrade from the DX3 Pro, featuring enhanced audio components, up to 60% lower distortion ratings, doubled power, and improved output impedance. It's a substantial evolution from its predecessor.